Advantages of the use of thermal pads

Advantages of the use of thermal pads

Thermal pads is used in all walks of life due to its low cost and high efficiency. It has a wide range of thicknesses and shapes, and has a natural viscosity on the surface, which is more convenient to use than other smear-type thermally conductive materials. Thermally conductive pad is a new type of material widely used in electronic products. Its application advantages are:
1. When a large area of heat conduction is required inside the product to dissipate heat, it is easy to waste and extremely inconvenient to use the smear-type thermal conductive material. At this time, the advantages of the thermal conductive silicone sheet are reflected. It can not only be cut into Any size is not wasteful, and it is very convenient to apply.
2. If the internal heat dissipation area of the electronics is relatively narrow, if the smear-type thermal conductive material is used, it is easy to apply the product to the area outside the heat dissipation area, causing waste, and even causing an internal short circuit of the product, which will affect the use of the product. If the thermal conductive silicone sheet is used, it will not appear. the above risks. The thermally conductive silicone sheet will not be changed after long-term use, and there will be no precipitation of silicone oil.
3. When the thermal conduction area of the product is rough or uneven, the thermal conductive silicone sheet can be used. Its good compressibility can perfectly fill the uneven thermal conduction area, so that the thermal conduction effect of the product is optimal.
4. The thermal conductive silicone sheet is used to conduct heat, and the operation is very convenient. It is only necessary to tear off the two masks and use their micro-adhesion to fit them together, and then connect the radiator or shell, saving labor costs.
5. The thermal conductivity of our thermally conductive silicone sheet can be measured to 10W, which can be applied to many high-frequency heat-dissipating components.

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