Application of thermally conductive silicone gasket on routers

Application of thermally conductive silicone gasket on routers

Thermally Conductive Interface Materials Designed for Cooling Electronic Components

With the continuous intelligence of electronic products, as the “hub” of the Internet, Netcom products are developing in the direction of high speed, high quality, and easy integrated management, which puts forward higher requirements for the quality of Netcom products.

However, the increase in working frequency, working intensity, and network speed has brought the problem of increased power to Netcom products, followed by higher heat dissipation requirements. As an “auxiliary material” for electronic products, thermal interface materials can help electronic products improve heat dissipation efficiency, improve operating speed, stability, reliability and service life, and are an integral part of their thermal design.

Application of thermally conductive silicone gasket on routers

A router is mainly composed of hardware such as memory, power supply, CPU, cable, CSU/DSU, supplier media, interface, and module.

As the “media” of Internet access, the router needs to provide a strong network transmission speed, which is bound to generate huge heat. If the heat is too high during operation, it will affect the wireless signal, such as unstable signal or disconnection. In addition, in order to save cost and space, routers are developing in the direction of miniaturization, which increases the difficulty of heat dissipation.

Under normal circumstances, routers use passive heat dissipation, that is, heat dissipation through the heat dissipation holes of the fuselage, but only relying on the heat dissipation holes, the heat dissipation efficiency is not high. In order to solve problems such as heat dissipation and working stability of routers, engineers usually use thermally conductive silicone sheets combined with the casing to dissipate heat during thermal design.

When choosing a thermally conductive silicone gasket, it is often necessary to determine the selected specifications, thickness, thermal conductivity, etc. according to the heat source (such as CPU, memory, Modem module).

Product model details

Wireless router structure diagram

Schematic diagram of wireless router structure

Schematic diagram of shell heat conduction

Internal structure diagram of portable WLAN equipment

Modem internal structure diagram

Schematic diagram of temperature rise

Router temperature rise :

Indoor: The test surface temperature does not exceed 60°C in full load operation at ambient temperature; the CPU temperature does not exceed 80°C; over-temperature and frequency reduction.

Outdoor: Test the surface temperature of 70°C-80°C under full load at ambient temperature; the maximum temperature of CPU is 110-120°C, over-temperature frequency reduction

Portable WLAN temperature rise: running at full load at room temperature, the surface temperature of the device does not exceed 55°C, the CPU temperature does not exceed 65°C, and the frequency is over-temperature reduced.

Portable WLAN

Product   application scenarios

PRODUCT APPLICATION SCENARIOS

Main heating chip power and thermal interface material selection-thermal pad

Heat source powerMaterials usedUsageSpecial requirements
1-2W/3-5Wthermal pad
Thermal Conductivity:1.2-3w/m.k
Thickness:0.25-1.0mm
Breakdown Voltage:6kv
Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption.Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

Main heating chip power and thermal interface material selection-thermal pad

Heat source powerMaterials usedUsageSpecial requirements
2-4Wthermal pad
Thermal Conductivity : 1.5-3w/m.k
Thickness:0.5-1.0mm
Breakdown Voltage:6kv
Thermal conduction, filling and shock absorption between the internal decoding chip, main chip and output control IC of the Modem module and the aluminum radiator.Because routers/portable WLANs involve high-frequency emission sources such as wireless transmitting antennas, the requirements for gaskets must not affect electromagnetic waves.

Other router structures

Other router structures

Schematic diagram of switch structure

Heat source powerMaterials usedUsage
1-2W/3-5Wthermal pad
Thermal Conductivity:1.0-2.0w/m.k
Thickness:0.25-1.0mm
Breakdown Voltage:6kv
Fill the gap between the CPU, ADSL, wireless module and the aluminum radiator, transfer the chip heat to the radiator, and play the role of heat conduction and shock absorption.

The future development trend of  Netcom

THE FUTURE TREND OF NETCOM

Hardware and functions-smart router

With the increase of product functions, the heat dissipation of the device will become a very severe test for engineers (increased heating components, increased power consumption, and compact structure). The requirements for thermal conductivity materials will also increase. The more diverse.

Network traffic growth

With the intelligentization of processing electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network, so the working frequency and intensity of Netcom products will increase accordingly, and the rapid increase in network speed will also increase the power of Netcom products. And other issues still bring higher demand for heat dissipation.

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