B ultrasonic machine thermal conduction solution

B ultrasonic machine thermal conduction solution

Introduction of Ultrasound Machine:

Ultrasound machine is also called color ultrasound, three-dimensional ultrasound, four-dimensional ultrasound and so on.
B-mode ultrasonography is a new subject that has developed rapidly in recent years, and it has become an indispensable diagnostic method in modern clinical medicine. b-ultrasound can clearly display various cross-sectional images of various organs and surrounding organs. Because the images are full of solidity and close to the real structure of anatomy, the application of ultrasound can make an early diagnosis.

B ultrasonic machine thermal conduction solution

The components of the B ultrasound machine:

The basic components of the B-mode ultrasound machine include five main components, including transmitting, scanning, receiving, signal processing and display, which are divided into two major components, namely the host and the probe. The key component of the B-ultrasound machine is the ultrasonic probe, which has an ultrasonic transducer inside to realize the conversion of electrical signals and ultrasonic waves. The host is mainly used to receive the information collected by the probe, process it accordingly, and display the results in the form of images.

B ultrasonic machine

The working principle of B ultrasound machine:

The basic principle of B-ultrasound machine is to transmit a set of ultrasonic waves to the human body through the ultrasonic probe, and scan in a certain direction. According to the delay time of the monitoring echo and the law of the strength of the echo, the distance and nature of each organ can be judged. Combined with pathology and clinical medicine, after observing, analyzing and summarizing various reflection laws, the location, nature and characteristics of the lesion can be determined. The degree of dysfunction makes a diagnosis.
The general working process of B-mode ultrasound is as follows: The ultrasonic probe emits ultrasonic waves after obtaining the excitation pulse, and after a delay for a period of time, the echo signal reflected back is received by the ultrasonic probe, and then some signal processing such as filtering and logarithmic amplification are performed, and then the DSC circuit is used. Digital transformation is performed to form digital signals, which are controlled by the CPU to further process the image, and together with the chart forming circuit and the measuring circuit, the synthesized video signal is transmitted to the display to form the B-ultrasound image we usually see.

Glue requirements for B ultrasound machine:

  1. High bonding strength to the chassis frame;
  2. Excellent heat dissipation for heating components;
  3. Environmental protection, non-toxic, with routine testing certification and qualifications;
  4. Moisture-proof, anti-static, dust-proof, mildew-proof, salt-fog resistance, etc. for circuit boards.

Glue scheme for B ultrasound machine:

Glue point for ultrasound machineGlue function categoryFeatures of glue
Cooling componentsThermal GreaseExcellent thermal conductivity, good insulation effect, moisture-proof, dust-proof, anti-corrosion, shock-proof and other properties
Plastics and Metalsadhesive sealantHigh bonding strength, no corrosion to PC, PP, ABS, PVC and other materials, high and low temperature resistance, moisture resistance, aging resistance, strong weather resistance
SMT patchpatch glueGood bonding effect, suitable for bonding of heat-sensitive components with low temperature curing, or use in occasions where rapid curing is required
Electronic Componentsfixing glueStrong adhesion and fixation to electronic components, excellent dielectric properties and good heat resistance
circuit boardThree-proof glueGood protective performance, and has good dust-proof, moisture-proof, anti-static, shock-proof performance

Due to the different structure, operating environment and process of the B-ultrasound machine, the glue application plan is different. For more detailed plans, please contact Cohetion

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