Computer Motherboard Heat Dissipation Application

Computer Motherboard Heat Dissipation Application

The thermal transfer medium solution between the motherboard IC on the computer host and the heat sink or shell is to use thermally conductive silicone sheets. Compared with the previous relatively traditional thermal medium materials such as thermally conductive silicone, phase change materials, etc., produced by Lian Tengda Technology Co., Ltd. The high-quality thermal conductive silicone sheet has advantages in the thermal application of the motherboard IC. The raw materials of the thermally conductive silicone sheet products we produce are imported from Japan. The thermally conductive silicone sheet can be better compressed when used between the IC and the heat sink and make the contact area smaller. Big. So that the heat conduction effect can achieve good effect. Therefore, the thermal conductive silicone sheet is now widely used in the main IC. The thermal conductive silicone sheet can be cut arbitrarily according to the size or shape of the IC, and has good insulation and is convenient to use. Both sides are slightly sticky, only You need to tear off the protective film and stick it on a smooth and clean surface.

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