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CTLC1000 thermal pad
soft thermal gap filler
Product description
CTLC1000 Ultra-high thermal pad is a high-performance thermal conductivity interface material, which is made of imported raw materials and used to fill the air gap between the heating element and the heat sink or metal base. Their flexibility and elasticity make them suitable for covering completely uneven surface. The heat is conducted from the separated device or the entire PCB to the metal casing or the diffusion plate, effectively improving the heat dissipation performance and improving the efficiency and service life of the heating electronic components.
Product Features
Technical Specification
| Test Item | Unit | CTLC1000 | Test Method |
|---|---|---|---|
|
Colour |
- |
Gray |
Visually |
|
Thickness |
mm |
0.5~5.0 |
ASTM D374/374M |
|
Hardness |
Shore AO |
20±5 |
GB/T531 |
|
Hardness |
Shore OO |
70±10 |
ASTM D2240 |
|
Specific Gravity |
g/cm3 |
3.65 |
ASTM D792 |
|
Tensile Strength |
MPa |
0.15 |
ASTM D412 |
|
Elongation at Break |
% |
15 |
ASTM D412 |
|
Breakdown Voltage |
KV/mm |
≥5 |
ASTM D149 |
|
Volume Resistivity |
Ω·cm |
1x1011 |
ASTM D257 |
|
Temp Resistance |
℃ |
-40~200 |
- |
|
Flame |
- |
V-0 |
UL 94 |
|
Weight Loss |
% |
≤0.5 |
@150℃240H |
|
Permittivity |
@1MHz |
7.32 |
ASTM D150 |
|
Thermal Conductivity |
W/mk |
10.0 |
ISO 22007-2 |
|
Thermal Conductivity |
W/mk |
10.0 |
ASTM D5470 |
|
Thermal Impedance |
℃·in2/W |
0.167 |
ASTM D5470 |
|
Thermal Impedance |
℃·cm2/W |
1.077 |
ASTM D5470 |
|
Specific Heat Capacity |
J/g/k |
0.786 |
ASTM E1269 |
Typical Applications
Configurations Available:
Build a Part Number
CTLC1000–HOO60–T10–50–100–NA
CTLC1000: CTLC1000 with thermal conductivity 10.0w/mk.
HOO60: Hardness Shore OO 60
T10: Thickness = 1.0mm.
50: Width = 50mm.
100: Length = 100mm.
NA: Your part/drawing No.