CTLC500 thermal pad

CTLC500 The high thermal pad is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are made of Denka high thermal conductivity spherical alumina powder and Dow Corning polymer. It is a cost-effective thermal conductivity Insulation filling material, the natural micro-viscosity and softness of the surface can fully fill the air gap, complete the seamless heat transfer between the heat source and the heat sink, and improve the thermal conductivity. It is often used in scenarios requiring high-performance thermal conductivity, and is an ideal thermal interface material.