CTLCF300Y potting compound

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CTLCF300Y potting compound

silicone sealant

Product description

Thermal conductive potting compound is a low-viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules during curing, has excellent thermal conductivity and insulation properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies. Sensors, photovoltaic junction boxes, etc., provide protection for electrical / electronic devices and components under severe conditions such as high humidity, extreme temperature, thermal cycle stress, mechanical shock and vibration, mold, dirt, etc., no contact thermal resistance, seamless contact Heat-generating electronic components, heat is conducted from the separation device or the entire PCB to the metal shell or diffusion plate, thereby improving the efficiency and service life of the heat-generating electronic components.

Product Features

  • High thermal conductivity, low viscosity.
  • Good fluidity and rapid defoaming.
  • Curing at room temperature, heating can speed up the curing speed.
  • No corrosion to the substrate.

Technical Specification

Test Item CTLCY300 Test Method
A Part
B Part
Appearance
White
Grey
Visual
Adhesion
20000±1000
20000±1000
ASTM D2857
Mixing Ratio
1:1
/
Performance After Mixing
Adhesion
20000mPa·s/25℃
ASTM E3116
Operable Time
45min/25℃
ASTM C679
Curing Time
480min/25℃
/
Properties After Curing
Appearance
Gray Solid
Visual
Thermal Conductivity
3.0±0.3 W/mk
ISO22007
Hardness
50±5 Shore A
ASTM D2240
Specific Gravity
3.01g/cm3±0.05
ASTM D792
Tensile Strength
0.85MPa
ASTM D412
Volume Resistivity
1x1013Ω·cm
ASTM D257
Breakdown Voltage
>15KV/mm
ASTM D149
Dielectric Constant
5.0(@1MHz)
ASTM D150
Linear Expansion Coefficient
83 μm/(m·℃)
ASTM E228
Flame Rating
V-0
UL94
Continuous Use Temp
-40~200 ℃
/
Specific Heat Capacity
0.858 J/(g*k)
ASTM D1269
Potting-Compound

Typical Applications

  • Potting protection for power modules, inverters and ballasts.
  • Potting protection of electronic control unit and sensors.
  • Potting protection of LED lighting components.
  • Potting applications for other suitable products.

Configurations Available:

Packaging: components A and B are packed in independent plastic drums, and the package specification is 25kg / 25kg.

Storage: it shall be stored in a cool and dry place without direct sunlight. It is recommended that the storage temperature be lower than 27 ℃. It can be stored for 6 months from the production date when it is unopened and well sealed. During storage, the filler may settle, which is normal. It should be mixed evenly before use.

Build a Part Number

CTLCF300Y – 50KGNA

CTLCF300Y: CTLCF300Y with thermal conductivity 3.0w/mk.

50KG: Package A part 25kg & B part 25kg

NA: Your part No.

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