Factors affecting thermal conductivity of thermal silica gel sheet

Factors affecting thermal conductivity of thermal silica gel sheet

The main base material of the thermally conductive silicone sheet is silica gel, which is a thermally conductive medium material synthesized by adding various auxiliary materials such as metal oxides through a special process. The following is a specific introduction to the factors affecting the thermal conductivity of thermally conductive silicone sheets.
1. Types and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the dispersion of the filler in the basic, and the better the degree of bonding between them, so the thermal conductivity of the thermally conductive silicone sheet will be higher. Okay
2. Types of fillers: The higher the thermal conductivity of the filler, the higher the thermal conductivity of the silicone sheet will be.
3. Filler content: The distribution of the filler polymer determines the thermal conductivity of the thermally conductive silicone sheet. When the filler content is small, the thermal conductivity effect is not obvious; when the direction of the thermal network chain is consistent with the heat flow direction, the thermal conductivity most. Therefore, there is a certain critical value for the amount of thermally conductive filler.
4. The shape of the filler: The path that is easy to form the thermal conductivity sequence is whisker-fiber-chip-granular. The easier the filler is to form a thermal path, the better the thermal conductivity will be.
5. The bonding characteristics of the interface between the filler and the substrate material: the higher the degree of bonding between the filler and the substrate, the better the thermal conductivity. The surface treatment of the filler with a suitable coupling agent can increase the thermal conductivity by 10%~20%

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