In the use of modern electronic products, the problem of heat generation has become extremely serious. In order to ensure operating efficiency, it is necessary to actively strive to solve the problem of heat dissipation. For example, in PCs, in order to solve the problem of CPU heating, thermal grease is usually applied between the heat sink and the CPU. Today, with the development of science, electronic products are running faster and faster, and heat dissipation is still the work of various manufacturers. A major problem to be solved is the thermal pad that is widely used today. It is called a new generation of new thermal conductivity technology. As soon as it is listed, it shows the possibility of replacing thermal grease. The choice of it is mainly determined by the thickness!
Strictly speaking, the thickness of the thermal pads has an inseparable relationship with its thermal conductivity. Why do say that? Let’s start with the thermal conduction path and principle of the thermal pad. First of all, we must be clear that when the thermal pad is pasted on a heating component, its working principle is to transfer heat from one end to the other end. The closer the distance between the heating body and the heat sink, the more sufficient the heat it transfers The more, the lower the thermal resistance and the better the thermal conductivity. So, what effect does the thickness of the thermal pads have on the heat dissipation of electronic products? Let’s take a look together!
Thickness will directly affect thermal resistance coefficient
Thermal resistance coefficient refers to the resistance it encounters in the process of heat transfer. Literally speaking, the smaller the resistance, the stronger the thermal conductivity. The thermal resistance coefficient of the thermal grease used in the early PC is very low, so it is very popular with various manufacturers. It may dry out. The thickness of the thermal pads determines the thermal resistance coefficient, but it should be noted here that the thinner the thermal pad, the better the thermal conductivity. For the choice of thickness, it mainly depends on the specific heat dissipation object.
Different thickness, different price
The thermal pads has shrinkage, so to a certain extent, it also plays a shock-proof role for electronic products. It can not only resist shocks but also conduct excess heat. The thickness of the thermal pad is also different at different price points. When choosing a thermal pad for electronic products, the thickness should be determined according to the actual situation. Too thick and thin will cause corresponding waste. Usually, the range of thickness selection is very wide, between 0.2mm-10mm, and different thicknesses determine heat transfer. The length of the path also determines the size and price of the thermal resistance coefficient.
Thickness will determine the overall structural design
In today’s era, the design of electronic circuits is becoming more and more complex, and the integration of circuits is getting higher and higher, but because of this, there will be many chips of different sizes on a circuit board, their sizes and voltages are different, and the heat dissipation is also Not the same, not to mention the problem of uneven distribution of the overall bulk of the circuit board. If the thermal pads wants to serve such a complex circuit well, the choice of the thickness of the silicone sheet on each chip should be treated specifically, rather than using a uniform thickness to solve all problems. The thickness of the thermal pads has an impact on the heat dissipation of electronic products in its market-oriented price, and will also affect the overall structural design of the product. It has to be said that in modern electronic products, the thermal pad is an important part of it.