Low Specific Gravity Thermal Pad
Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.
- High thermal conductivity, low thermal resistance and low specific gravity.
- Low dielectric constant, low dielectric loss.
- Low pressure applications to protect sensitive electronic components.
- Natural stickiness, easy to assemble and rework.
- UAV intelligent equipment.
- 5G mobile communication electronic equipment.
- Network communication electronics.
- Automotive electronics.
- Smart wearable devices.
|Test item||Unit||LC300BN||Test Methods|
|Specific Gravity||g/cm³||1.39||ASTM D792|
|Tensile Strength||MPa||0.24||ASTM D412|
|Elongation At Break||%||40||ASTM D412|
|Tearing Strength||KN/m||0.5||ASTM D624|
|Breakdown Voltage||KV/mm||≥10||ASTM D149|
|Volume Resistivity||Ω·cm||1×1014||ASTM D257|
|Temperature Resistance Range||℃||-40~200||–|
|Dielectric Dissipation||@1MHz||≤0.001||ASTM D150|
|Thermal Conductivity||W/M·K||3.0||ISO 22007-2|
|Thermal Impedance||℃·in²/W||0.591||ASTM D5470|
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.
NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.