Low Specific Gravity Thermal Pad

Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.

Features

• High thermal conductivity, low thermal resistance and low specific gravity.
• Low dielectric constant, low dielectric loss.
• Low pressure applications to protect sensitive electronic components.
• Natural stickiness, easy to assemble and rework.

Applications

• UAV intelligent equipment.
• 5G mobile communication electronic equipment.
• Network communication electronics.
• Automotive electronics.
• Smart wearable devices.