Low Specific Gravity Thermal Pad

Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.

Features

  • High thermal conductivity, low thermal resistance and low specific gravity.
  • Low dielectric constant, low dielectric loss.
  • Low pressure applications to protect sensitive electronic components.
  • Natural stickiness, easy to assemble and rework.

Applications

  • UAV intelligent equipment.
  • 5G mobile communication electronic equipment.
  • Network communication electronics.
  • Automotive electronics.
  • Smart wearable devices.
Test itemUnitLC300BNTest Methods
ColorOff-WhiteVisually
Thicknessmm0.5~5ASTM D374/374M
HardnessShore AO40±5GB/T531
Specific Gravityg/cm³1.39ASTM D792
Tensile StrengthMPa0.24ASTM D412
Elongation At Break%40ASTM D412
Tearing StrengthKN/m0.5ASTM D624
Breakdown VoltageKV/mm≥10ASTM D149
Volume ResistivityΩ·cm1×1014ASTM D257
Temperature Resistance Range-40~200
FlameFlameUL 94
Weight Loss%≤0.5@150℃240H
Permittivity@1MHz3.24ASTM D150
Dielectric Dissipation@1MHz≤0.001ASTM D150
Thermal ConductivityW/M·K3.0ISO 22007-2
Thermal Impedance℃·in²/W0.591ASTM D5470

Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.

NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.