One Component Thermal Conductive Gel

Single component thermal conductive gel is a kind of thermal conductive material with lower deformation force. It has similar plasticity of plasticized, non flowing, high thermal conductivity and low thermal resistance. It has good insulation, good insulation, and can fill the gap automatically, so that the contact area can reach full contact. It can be applied to the heat dissipation module or electronic component with larger thickness. Unlike thermal conductive silicone grease, heat conductive gel has no sedimentation and no flow phenomenon. It is suitable for screen printing or scraping. The syringe packaging can be dispensed on standard dispensing equipment, so as to effectively improve operation convenience and efficiency.

Features

  • High thermal conductivity, low thermal resistance, good wettability.
  • No settlement, no flow, can fill any uneven gap.
  • Soft, no stress, can be compressed to 0.1 mm thin.
  • The design and application are convenient, and the automatic dispensing can adjust the size of any thickness.

Applications

  • Wireless electronic equipment.
  • Communication electronic hardware equipment.
  • Automotive electronic application equipment.
  • Chassis or related heat dissipation module.
  • Host or small office network equipment.
  • Microprocessors, memory chips and graphics processors.
Test itemUnitLCE200LCE300LCE380LCE500LCE600LCE700Test Methods
ColorBluePinkPinkGrayBlueGrayVisually
Specific Gravityg/cc2.983.373.393.443.383.5ASTM D792
Extrusion Rateg/min≥40≥40≥40≥20≥15≥10φ2.54mm 90psi
Thickness After Compressionmm0.10.10.10.20.20.2
Weight Loss%≤0.3≤0.3≤0.2≤0.2≤0.2≤0.2@150℃240H
Breakdown VoltageKV/mm≥7≥7≥7≥7≥5≥5ASTM D149
Volume ResistivityΩ·cm1×10131×10131×10131×10131×10121×1011ASTM D257
Continuous Use Temp-40~150-40~150-40~150-40~150-40~150-40~150
Thermal ConductivityW/M·K2.03.03.85.06.07.0ISO 22007-2
Thermal Impedance℃·in2 /W0.0900.0580.0460.0330.0240.023ASTM D5470

Conventional packaging: 1 kg / can, 5 kg / barrel, 10 kg / barrel, 20 kg / barrel.

Syringe: 30cc, 55CC, 300cc.

Note: Thermal impedance at 0.1 mm

LCE360T One Component Thermal Gel

lce360T one-part liquid gap fifiller is a preformed thermal gap fifilling material, which can be solidifified at room temperature or high temperature to form a flflexible and thermally conductive elastomer, which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high effiffifficiency. It has good contact with electronic products, increases effffective contact area and reduces contact thermal resistance. It can automatically fifill the gap and compress infifinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.

Features

  • High thermal conductivity, low thermal resistance, good wettability.
  • Lower assembly stress, easy to operate.
  • High reliability, after curing, it is equivalent to thermal pad, no volatilization.
  • Automatic dispensing adjustment of any thickness.
  • After curing, the modulus is low, which greatly reduces the stress caused by thermal expansion and the damage caused by vibration.

Applications

  • Network terminal /5G mobile phone communication.
  • New energy battery.
  • Automotive electronic application equipment.
  • Electronic medical / power equipment.
  • Between fragile components and housing.
Test ItemUnitLCE360TTest Mothods
ColorBlueVisually
Extrusion speedg/20s10090psi@φ2.54mm
BLTμm50
HardnessShore 0050±5ASTM D2240
Densityg/cm33.39ASTM D792
Thermal ConductivityW/M·K3.6±0.3ISO 22007
Breakdown VoltageKV/mm≥8ASTM D149
Volume ResistivityΩ·cm1.0*1012ASTM D257
Tensile StrengthMPa0.18ASTM D412
Elongation At Break%>300ASTM D412
FlameV-0UL 94
Curing Timemin60@100℃
Thermal Impedance℃·cm2/W0.154ASTM D5470

Syringe: 30cc, 55CC, 300cc.

Storage conditions: 6 months shelf life at 0°C.

Note: Thermal impedance at 0.1 mm.