Tablet PC Thermal Solutions

Tablet PC Introduction:

Tablets are also called portable computers.
A tablet is a small, portable personal computer with a touch screen as the basic input device. It has a touch screen (also known as tablet technology) that allows users to work with a stylus or digital pen instead of a traditional keyboard or mouse.

Tablet PC Thermal Solutions

Tablet PC Principle:

The tablet computer is composed of audio signal processing circuit, microprocessor circuit, image processing circuit, touch control circuit, DDR memory circuit, power supply and management circuit, WLAN circuit, Bluetooth circuit, etc.

Tablet

Tablet PC Composition:

Tablet PC consists of external front bezel, touch screen, display screen, internal motherboard, CPU, heat sink, memory, hard disk, graphics card, sound card, touch module, wide voltage module, I/O interface, wire, back plate, etc.

With the popularity of ipad all over the world, MID products with ultra-thin, touch screen and intelligent system have become the latest consumer favorites; in the design and manufacture of tablet computers, the combination of alloy and engineering plastics for the shell has become a new trend. In the process of production and assembly, the threads and buckles of the optical sensor are very suitable for the realization of ultra-thin, ultra-light, and three-dimensional beauty. In order to realize the gap-free and flat appearance of the tablet, more and more adhesives are used in the assembly process. To bond and fit components.

Glue requirements for tablet PCs:

  1. The initial bonding time is short;
  2. High bonding strength to the chassis frame;
  3. Excellent heat dissipation for CPU and other heating components;
  4. Environmental protection, with routine testing certification and qualifications;
  5. Moisture-proof, anti-static, dust-proof, mildew-proof, salt spray resistance, etc. for circuit boards.

Glue scheme for tablet PC:

Glue dots for tabletsGlue function categoryAdhesive Solution Features
CPU coolingThermal grease thermal pasteExcellent heat resistance and thermal conductivity, good thermal conductivity, temperature range -50~200℃
TP screen and frameadhesive sealantHigh bonding strength, good insulation and stable material properties
Aluminum alloy back cover and ABS frameStructural adhesiveHigh strength, peeling resistance, impact resistance, simple construction process
circuit boardThree anti-paintGood protective performance, with moisture-proof, anti-static, dust-proof, anti-mold, salt spray resistance and other properties

Due to the difference in the actual operating environment, structure and process of the tablet computer, the glue application plan is different. For more detailed plans, please contact Cohetion

Smartphone Thermal Solutions

The frequency of smartphone chips is getting higher and higher, which will generate a lot of heat. Excessive heat will affect the user’s comfort and may also burn out the hardware. Therefore, major manufacturers will consider how to dissipate heat from smartphones.

Smartphone Thermal Solutions

After entering 2019, mobile phone cooling has once again become a new hot spot in the market, driven by the rigid needs of mobile phones in the future. For example, Xiaomi’s flagship gaming phone, the Black Shark, is equipped with a multi-level direct-touch integrated heat-cooling system. The main heat-dissipating part is copper sheets, and only the slender part in the middle has a very small amount of built-in liquid; there is also the Honor Note10, which uses The Nine heat-cooling technology is adopted, a liquid-cooling heat-dissipating layer is added on the basis of the original eight-layer heat-dissipation, and graphite paste heat conduction and heat pipes are used; in addition, Meizu 16 also adopts water-cooling heat dissipation, and the surface of the processor is coated with heat conduction Silicone grease, further improve the thermal conductivity!

With the advent of the 5G era, mobile phone heat dissipation has become a hot spot in the industry. Under the circumstance that the battery capacity of smartphones cannot be greatly improved, in addition to developing solutions to reduce energy consumption, the importance of heat dissipation for smartphones is further highlighted. , the current glass back cover will become the mainstream of the market, and its heat dissipation performance is worse than that of the metal back cover, which is also an important reason why many current glass back cover mobile phones use graphite sheets attached to the glass back cover! According to market sources, Huawei’s 5G mobile phone is expected to use 0.4mm copper sheet and apply thermal grease to fill the gap as the core heat dissipation component of the mobile phone!

graphite heatsink

5G mobile phone antennas and RF front-ends will undergo major changes. High-frequency mobile phone antennas are expected to adopt active methods. The power consumption of mobile phones will increase significantly. In addition to technology, there will be cooling technologies in the future, including some new cooling materials will also be applied in smartphones.

graphite sheet

As the application of heat dissipation components in mobile phones and PCs becomes more and more extensive, many companies have already laid out the fields of heat dissipation components and materials. With the advent of the 5G + Internet of Things era, the degree of intelligence of mobile phones and people’s dependence on mobile phones will be different in the future. As the direction of smartphone research and development, the application of cooling technology in smartphones will become more and more important. The demand for heat dissipation will also drive changes in heat dissipation materials and research on new technologies, and more and more companies will conduct layout or industrial upgrades in this field.

Cohetion has an excellent scientific research team in the field of heat conduction and heat dissipation, and has provided one-stop heat conduction solutions for the heat dissipation of electronic products for more than ten years. When 5G is coming, when Western technology is blocked, it will contribute to China’s intelligent manufacturing.

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