Thermal Conductive Ceramic

The thermal conductivity of the ceramic sheet is as high as 24W / M.K. it is resistant to high temperature and high pressure. The surface of the ceramic sheet is smooth without burr and burr. It is heated evenly and dissipates heat quickly; Simple and compact structure, small size, high strength, not easy to break, acid and alkali corrosion resistance, durable.


  • Superior chemical and mechanical stability.
  • High hardness, high wear resistance.
  • High thermal conductivity, high electrical insulation.
  • Effective anti-interference (EMI), anti-static.


  • IC / MOS / triode.
  • Surface heat source for diode and IGBT.
  • High density switching power supply.
  • High frequency communication equipment.
  • High frequency welding machine and other equipment.
Test itemUnitLT240Test Methods
Specific Gravityg/cm33.70GB/T 2413
ThermalConductivity(25℃)W/M·K24ISO 22007-2
Dielectric Constant1MHz9~10GB/T 5594.4
Breakdown VoltageKV/mm≥17GB/T 5593
Flexural strengthMPa≥400GB/T 5593
Surface Roughnessμm0.2-0.75GB/T 6062
Water Absorption%0GB/T 3299
Volume Resistivity(20℃)Ω.cm≥1014GB/T 5594.5
Thermal Expansivity10-6 ℃-1 (20-300℃)6.5-7.5GB/T 5594.3
Thermal Expansivity10-6 ℃-1 (300-800℃)6.5-8.0GB/T 5594.3

Conventional thickness:0.3MM,0.38MM,0.5MM,0.635MM, 0.76MM,0.8MM,1.0MM, 1.2MM,1.5MM,2.0MM.

Basic specifications: TO-220, TO-247, to-264, to-3p and other conventional MOS tube fit size, non-standard size can be customized.