Thermally Conductive Interface Materials Designed for Cooling Electronic Components
With the development of the new energy vehicle industry, new forces of new energy vehicle manufacturing continue to emerge, and automotive intelligence also develops rapidly, and technology companies have deployed automotive electronics.
As people have higher and higher requirements for driving comfort, safety, entertainment, economy and other performance, the number of electronic components in the car is also increasing, and the automotive electronic system is also complicated, which is bound to its safety and reliability. put forward higher requirements.
High temperature is an acceleration factor for the aging of electronic components. Poor heat dissipation design will seriously affect the reliability, safety, and durability of electronic components. Cars will also produce bad noise and vibration during driving, causing auto manufacturers to maintain product warranty maintenance. , vehicle quality satisfaction and other issues.
Cohetion series thermal conductivity products have mature thermal management material solutions in new energy vehicle battery pack, motor controller (MCU), body electronic control (ECU), vehicle charger, chassis control, vehicle entertainment and other systems, which can provide heat dissipation /Heat soaking/thermal conduction/thermal insulation and other series of product supporting solutions to help customers achieve the safety and reliability of automotive electronic products.
Thermal solution for BMS battery management system
BMS battery management system, commonly known as battery nanny, is mainly to ensure that the battery pack works within a safe range, provide information required for vehicle control, deal with abnormal situations in time, according to ambient temperature, battery status and online fault diagnosis, charging control, automatic balance, thermal management, etc.
BMS needs to perform a lot of calculations and signal control when it is working. As it develops in the direction of simplicity and miniaturization, heat must be generated inside it. In order to avoid affecting its normal operation, the heat must be transferred out. The thermal interface material is filled between the heat dissipation components to efficiently solve the problems of heat conduction, insulation and shock absorption.
BMS rated voltage: 5V~12V; heat dissipation method: aluminum shell heat dissipation
The heat dissipation scheme can use Cohetion thermal conductive silicone gasket LCP200 series. LCP200 is a super soft material with high thermal conductivity, which has low stress on the structure and plays the role of buffer protection. Thermal resistance, can cut different shapes according to customer needs, high and low temperature resistance, anti-oxidation, long-term use of product performance is stable and reliable.
How to use: Attach the electronic original pin corner surface on the back of the PCB;
Function 1: Conduct the heat of the electronic components to the shell to dissipate heat;
Function 2: The function of covering the pin surface to prevent leakage and piercing of the shell to protect the electronic originals.