Universal High Cost Performance Thermal Pad
LC thermal pad is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
Features
- Low cost, high efficiency and high cost performance.
- Thermal conductive silicone grease to replace volatile pollution.
- Natural stickiness, easy assembly, repeatable disassembly.
- High electrical insulation.
Applications
- Computer / communication equipment.
- Laptop / tablet / PC server.
- New energy power battery / vehicle equipment.
- Switching power supply / UPS.
- Video / security equipment.
- Any heating element and radiator.
| Tesst Item | Unit | LC120 | LC200 | LC300 | Test Methods |
|---|---|---|---|---|---|
| Color | – | Off-White | Light-Blue | Light-Blue | Visually |
| Thickness | mm | 0.3~15 | 0.3~10 | 0.3~10 | ASTM D374/374M |
| Hardness | Shore AO | 30±5 | 30±5 | 30±5 | GB/T531 |
| Specific | g/cm3 | 2.07 | 2.74 | 3.0 | ASTM D792 |
| Tensile Strength | Mpa | 0.34 | 0.26 | 0.19 | ASTM D412 |
| Elongation At Break | % | 100 | 80 | 40 | ASTM D412 |
| Tearing Strength | KN/m | 1.4 | 0.8 | 0.9 | ASTM D624 |
| Breakdown Voltage | KV/mm | ≥10 | ≥10 | ≥10 | ASTM D149 |
| Volume Resistivity | Ω·cm | 1×10¹³ | 1×10¹³ | 1×10¹³ | ASTM D257 |
| Temperature Resistance Range | ℃ | -40~200 | -40~200 | -40~200 | – |
| Flame | – | V-0 | V-0 | V-0 | UL 94 |
| Weight Loss | % | ≤0.3 | ≤0.3 | ≤0.3 | @150℃240H |
| Permittivity | @1MHz | 5.41 | 6.28 | 7.0 | ASTM D150 |
| Thermal Conductivity | W/M·K | 1.2 | 2.0 | 3.0 | ISO 22007-2 |
| Thermal Impedance | ℃·in² /W | 1.108 | 0.787 | 0.483 | ASTM D5470 |
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.
NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.