Universal High Cost Performance Thermal Pad

LC thermal pad is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.


  • Low cost, high efficiency and high cost performance.
  • Thermal conductive silicone grease to replace volatile pollution.
  • Natural stickiness, easy assembly, repeatable disassembly.
  • High electrical insulation.


  • Computer / communication equipment.
  • Laptop / tablet / PC server.
  • New energy power battery / vehicle equipment.
  • Switching power supply / UPS.
  • Video / security equipment.
  • Any heating element and radiator.
Tesst ItemUnitLC120LC200LC300Test Methods
Thicknessmm0.3~150.3~100.3~10ASTM D374/374M
HardnessShore AO30±530±530±5GB/T531
Specificg/cm32.072.743.0ASTM D792
Tensile StrengthMpa0.340.260.19ASTM D412
Elongation At Break%1008040ASTM D412
Tearing StrengthKN/m1.40.80.9ASTM D624
Breakdown VoltageKV/mm≥10≥10≥10ASTM D149
Volume ResistivityΩ·cm1×10¹³1×10¹³1×10¹³ASTM D257
Temperature Resistance Range-40~200-40~200-40~200
FlameV-0V-0V-0UL 94
Weight Loss%≤0.3≤0.3≤0.3@150℃240H
Permittivity@1MHz5.416.287.0ASTM D150
Thermal ConductivityW/M·K1.22.03.0ISO 22007-2
Thermal Impedance℃·in² /W1.1080.7870.483ASTM D5470

Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.

NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.