Ultra High Thermal Conductivity Thermal Pad

Ultra high thermal conductivity silicon pad is a high-performance heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it to cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.


  • Excellent thermal conductivity, high thermal conductivity, low thermal resistance.
  • High fit, soft and elastic.
  • High electrical insulation, protect sensitive electronic devices.
  • Natural stickiness, easy to assemble and disassemble.


  • CPU / memory / high speed hard disk drive.
  • Microprocessors, memory chips and graphics processors.
  • Automobile engine control module.
  • Communication electronic hardware equipment.
  • Military electronic equipment.
Test itemUnitLC700LC800LC1000Test Methods
Thicknessmm0.5~50.5~50.5~5ASTM D374/374M
HardnessShore AO30±530±530±5GB/T531
Specific Gravityg/cm³3.53.553.39ASTM D792
Tensile StrengthMPa0.150.150.15ASTM D412
Elongation At Break%242415ASTM D412
Tearing StrengthKN/m0.50.50.3ASTM D624
Breakdown VoltageKV/mm≥7≥7≥8ASTM D149
Volume ResistivityΩ·cm3×10¹¹3×10¹¹1×10¹¹ASTM D257
Temperature Resistance Range-40~200-40~200-40~200
FlameV-0V-0V-0UL 94
Weight Loss%≤0.2≤0.2≤0.2@150℃240H
Permittivity@1MHz8.08.07.2ASTM D150
Thermal ConductivityW/M·K7.08.010.0ISO 22007-2
Thermal Impedance℃·in² /W0.1650.1650.155ASTM D5470

Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.

NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.