High Thermal Conductivity Thermal Pad
High conductive thermal conductivity silicon pad is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
Features
- Cost effective, high thermal conductivity, low thermal resistance.
- High fit, soft and elastic.
- High electrical insulation, protect sensitive electronic devices.
- Natural stickiness, easy to assemble and disassemble.
Applications
- CPU / memory / high speed hard disk drive.
- Microprocessors, memory chips and graphics processors.
- New energy vehicles and peripheral / charging machines.
- Network communication equipment.
- Heating module with high heat conduction demand.
| Test item | Unit | LC400 | LC500 | LC600 | Test Methods |
|---|---|---|---|---|---|
| Color | – | Grey | Grey | Grey | Visually |
| Thickness | mm | 0.5~5 | 0.5~5 | 0.5~5 | ASTM D374/374M |
| Hardness | Shore AO | 30±5 | 30±5 | 30±5 | GB/T531 |
| Specific Gravity | g/cm³ | 3.24 | 3.32 | 3.43 | ASTM D792 |
| Tensile Strength | Mpa | 0.14 | 0.20 | 0.22 | ASTM D412 |
| Elongation At Break | % | 32 | 60 | 16 | ASTM D412 |
| Tearing Strength | KN/m | 0.7 | 0.5 | 0.5 | ASTM D624 |
| Breakdown Voltage | KV/mm | ≥8 | ≥7 | ≥7 | ASTM D149 |
| Volume Resistivity | Ω·cm | 1×10¹³ | 2×10¹³ | 2×10¹³ | ASTM D257 |
| Temperature Resistance Range | ℃ | -40~200 | -40~200 | -40~200 | – |
| Flame | – | V-0 | V-0 | V-0 | UL 94 |
| Weight Loss | % | ≤0.2 | ≤0.2 | ≤0.2 | @150℃240H |
| Permittivity | @1MHz | 6.75 | 7.92 | 7.47 | ASTM D150 |
| Thermal Conductivity | W/M·K | 4.0 | 5.0 | 6.0 | ISO 22007-2 |
| Thermal Impedance | ℃·in² /W | 0.340 | 0.295 | 0.188 | ASTM D5470 |
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.
NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.