High Thermal Conductivity Thermal Pad

High conductive thermal conductivity silicon pad is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.


  • Cost effective, high thermal conductivity, low thermal resistance.
  • High fit, soft and elastic.
  • High electrical insulation, protect sensitive electronic devices.
  • Natural stickiness, easy to assemble and disassemble.


  • CPU / memory / high speed hard disk drive.
  • Microprocessors, memory chips and graphics processors.
  • New energy vehicles and peripheral / charging machines.
  • Network communication equipment.
  • Heating module with high heat conduction demand.
Test itemUnitLC400LC500LC600Test Methods
Thicknessmm0.5~50.5~50.5~5ASTM D374/374M
HardnessShore AO30±530±530±5GB/T531
Specific Gravityg/cm³3.243.323.43ASTM D792
Tensile StrengthMpa0.140.200.22ASTM D412
Elongation At Break%326016ASTM D412
Tearing StrengthKN/m0.70.50.5ASTM D624
Breakdown VoltageKV/mm≥8≥7≥7ASTM D149
Volume ResistivityΩ·cm 1×10¹³ 2×10¹³2×10¹³ASTM D257
Temperature Resistance Range-40~200-40~200-40~200
FlameV-0V-0V-0UL 94
Weight Loss%≤0.2≤0.2≤0.2@150℃240H
Permittivity@1MHz6.757.927.47ASTM D150
Thermal ConductivityW/M·K4.05.06.0ISO 22007-2
Thermal Impedance ℃·in² /W0.3400.2950.188ASTM D5470

Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.

NOTE: The parameters in the table are measured by a 2mm standard sample. The thermal impedance test conditions: thickness 1mm, pressure 40psi, average temperature 50℃.