Thermal Conductive Potting Compound

Thermal conductive potting compound is a low-viscosity two-component silicone potting material. This product has good flfluidity, does not produce small molecules during curing, has excellent thermal conductivity and insulation properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies. Sensors, photovoltaic junction boxes, etc., provide protectionfor electrical/electronic devices and components under severe conditions such as high humidity, extreme temperature, thermal cycle stress, mechanical shock and vibration, mold, dirt, etc., no contact thermal resistance, seamless contact Heat-generating electronic components, heat is conducted from the separation device or the entire PCB to the metal shell or diffffusion plate, thereby improving the effiffifficiency and service life of the heat-generating electronic components.

Features

  • High thermal conductivity, low viscosity.
  • Good fluidity and rapid defoaming.
  • Curing at room temperature, heating can speed up the curing speed.
  • No corrosion to the substrate.

Applications

  • Potting protection for power modules, inverters and ballasts.
  • Potting protection of electronic control unit and sensors.
  • Potting protection of LED lighting components.
  • Potting applications for other suitable products.
Test itemsLCF080YLCF150YLCF200YLCF300YTest Method
 A PartB PartA PartB PartA PartB PartA PartB Part
AppearanceWhite fluidGrey fluidWhite fluidGrey fluidWhite fluidGrey fluidWhite fluidGrey fluidVisual
Adhesion4200±5003600±5007500±5007000±50010000±100010000±100030000±150030000±1500ASTM D2857
Mixing ratio1:11:11:11:1/
Performance after mixing
Adhesion4000/25℃7000/25℃10000/25℃30000/25℃ASTM E3116
Operable time45min/25℃60min/25℃60min/25℃45min/25℃ASTM C679
Curing time480min/25℃480min/25℃480min/25℃480min/25℃/
Properties after curing
AppearanceGray solidGray solidGray solidGray solidVisual
Thermal Conductivity0.8±0.08W/m.k1.5±0.15W/m.k2.0±0.20W/m.k3.0±0.30W/m.kISO22007
Hardness50±5 ShoreA50±5 ShoreA50±5 ShoreA50±5 ShoreAASTM D2240
Specific Gravity1.64g/cm3 ±0.052.50g/cm3 ± 0.052.70g/cm3 ± 0.053.01g/cm3 ±0.05ASTM D792
Tensile Strength0.80MPa0.80MPa0.85MPa1.20MPaASTM D412
Volume Resistivity1×1014 Ω·cm2×1013 Ω·cm1.6×1013 Ω·cm1.0×1013 Ω·cmASTM D257
BreakdownVoltage15KV/mm15KV/mm15KV/mm10KV/mmASTM D149
Dielectric Constant2.8(@1MHz)3.7(@1MHz)4.2(@1MHz)5.0(@1MHz)ASTM D150
Linear expansion coefficient180μm/(m·℃)180μm/(m·℃)180μm/(m·℃)180μm/(m·℃)ASTM E228
Flame RatingV-0V-0V-0V-0UL94
Continuous Use Temp-40~150℃-40~180℃-40~180℃-40~180℃/

The above performance data were measured after curing at 25 ℃ and 55% RH for 1 day.

Packaging: components a and B are packed in independent plastic drums, and the package specification is 25kg / 25kg.

Storage: it shall be stored in a cool and dry place without direct sunlight. It is recommended that the storage temperature be lower than 27 ℃. It can be stored for 6 months from the production date when it is unopened and well sealed. During storage, the filler may settle, which is normal. It should be mixed evenly before use.

Potting Compound LCF001Y ( 9:1 )

Introduction:

LCF001Y potting compound is a low viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules during curing, has insulating properties after curing, and has no corrosion to various substrates. It is mainly used for potting of electronic components and circuit boards, such as driving power supplies, sensors, and photovoltaic junction boxes. etc., to protect electrical/electronic devices and components under harsh conditions such as high humidity, extreme temperatures, thermal cycling stress, mechanical shock and vibration, mold, dirt, etc.

1. Product Features

  • Low viscosity.
  • Good fluidity and rapid bubble discharge.
  • Room temperature curing, heating can accelerate the curing speed, no corrosion to the substrate.

2. The main purpose

  • Potting protection of power modules, inverters and ballasts.
  • Potting protection of electronic control units and sensors.
  • Potting protection of LED lighting components.
  • Potting applications for other suitable products in the industrial field.

3. Typical technical parameters

Test ItemTechnical indicatorsTest standard
 A PartB Part 
Exteriorcolorless transparent fluidcolorless transparent fluidVisual inspection
Viscosity1200±100200±50ASTM D2857- 16
Mixing ratio9:1/
Performance after mixing
Viscosity after mixing1000±100/25℃ASTM D2857- 16
Operation time90min/25℃ASTM C679- 15
Curing time480min/25℃/
Properties after curing
ExteriorTransparent solidVisual inspection
Hardness20±2 ShoreAASTM D2240- 15e1
Density0.97g/cm3 ±0.02ASTM D792
Tensile Strength/ASTM D412- 16
Volume resistivity1×1015Ω·cmASTM D257- 14

4. Instructions for use

Before using this product, the operator must read the product safety technical data (MSDS) carefully.

Mix: Mix components A and B evenly at a ratio of 9:1 (mass ratio or volume ratio). A well-mixed compound should have a uniform appearance. Mixing can be done with automatic mixing equipment or by hand.

Defoaming: Internal air bubbles have a great influence on the performance of the potting glue after curing. When the evenly mixed glue is injected into the container that needs to be potted, the mixing of air should be avoided. Vacuum equipment for defoaming.

Curing: The curing reaction begins at the beginning of the mixing process. At room temperature, the A and B components have a certain working time after they are uniformly mixed, during which the viscosity of the mixture will gradually increase, then a gel will appear, and finally it will transform into an elastomer. The operating time is sensitive to the ambient temperature (seasonal changes), and the amount of glue dispensed and the glue filling time should be controlled according to actual needs to avoid waste.

Repairability: When the defective workpiece needs to be repaired, the liquid silicone rubber can be easily and selectively removed. After the repair is completed, the repaired part can be re-filled with glue.

5. Material compatibility

Certain materials, chemicals, curing agents or plasticizers can inhibit the curing of LCF001Y, the following materials require special attention:

  • Contains lead, cadmium, mercury and other organic heavy metal compounds;
  • Organotin or silicone rubber containing organotin catalysts;
  • Sulfur, polysulfide, polysulfone or other sulfur-containing materials;
  • Amines, polyurethanes or other nitrogen-containing materials such as amine-curable epoxy resins;
  • Phosphorus, arsenic or other materials containing phosphorus or arsenic;
  • Plasticizers for unsaturated hydrocarbons;
  • some flux residue;

If there is doubt as to whether certain materials or surfaces will inhibit curing, it is recommended that a small-scale compatibility test be performed first to determine their suitability for a particular application. The presence of liquid or uncured product between the surface in question and the cured silicone interface indicates poor compatibility and may inhibit curing. When necessary, the application site needs to be cleaned.

6. Package

Components A and B are packaged in independent plastic drums, and the set size is 18KG/2KG.

7. Storage and expiration date

It should be stored in a cool and dry place, away from direct sunlight. The recommended storage temperature is lower than 27℃. 6 months from the date of manufacture in unopened and well-sealed condition. During storage, the filler may settle, which is normal and should be stirred evenly before use.

8 Safety Notice

This product is non-toxic and should avoid contact with eyes when using it. If contact with eyes, please rinse with plenty of water and seek medical treatment immediately. Avoid contact with children.