Thermal Radio Absorbing Pad

Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electromagnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic communication products in terms of heat conduction and electromagnetic shielding.

Features

• Dual advantages of radio absorbing and heat conduction.
• Good surface compatibility and self-adhesive.
• 2W measured thermal conductivity, low thermal resistance.
• Fire rating reaches UL94 V-0.

Applications

• Mobile communication equipment.
• Network terminal equipment.
• Intelligent electronic equipment.
• Electronic communication equipment.