Thermal Radio Absorbing Pad
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electromagnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic communication products in terms of heat conduction and electromagnetic shielding.
- Dual advantages of radio absorbing and heat conduction.
- Good surface compatibility and self-adhesive.
- 2W measured thermal conductivity, low thermal resistance.
- Fire rating reaches UL94 V-0.
- Mobile communication equipment.
- Network terminal equipment.
- Intelligent electronic equipment.
- Electronic communication equipment.
|Test item||Unit||LC200RS||LC300RS||Test Methods|
|Color||–||Dark Gray||Dark Gray||Visually|
|Specific Gravity||g/cm³||4.8||3.17||ASTM D792|
|Tensile Strength||MPa||0.36||0.27||ASTM D412|
|Elongation At Break||%||40||40||ASTM D412|
|Tearing Strength||KN/m||1.0||1.0||ASTM D624|
|Breakdown Voltage||KV/mm||250||＜2000||ASTM D149|
|Volume resistivity||Ω·cm||＜108||＜108||ASTM D257|
|Temperature Resistance Range||℃||-40~150||-40~200||–|
|Dielectric Dissipation||@1MHz||≤0.01||7*10-4||ASTM D150|
|Thermal conductivity||W/M·K||2.0||3.0||ISO 22007-2|
|Use Frequency Band||GHz||1-16||1-16||GJB 2038A-2011|
Can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.