Thermal Silicone Mud
Thermal conductive silica gel mud has good thermal conductivity and insulation, no flflow, no solidifification, no volatilization, high and low temperature resistance, no sticking to hands, strong plasticity, can be molded into any shape according to the demand, can be used repeatedly, easy to operate and other characteristics, and is fifilled between the uneven electronic components to be cooled and the radiator / shell, so as to make it close contact and reduce the thermal resistance, It can reduce the temperature of electroniccomponents quickly and effffectively, so as to prolong the service life of electronic components.


Features
- Superior chemical and mechanical stability.
- It is easy to cooperate with the product design with great thickness variation.
- Thermal insulation, excellent aging resistance.
- Rubber clay shape, non stick hand, strong plasticity, repeated use.
Applications
- LED lamp application industry.
- Solar energy industry.
- Back light unit.
- LCD-TV / PDP display projection equipment.
- Automotive electronics
Test item | Unit | LCD100 | LCD200 | LCD300 | Test Methods |
---|---|---|---|---|---|
Color | – | Off White | Off White | Off White | Visually |
Specific Gravity | g/cm3 | 2.2 | 2.5 | 3.0 | ASTM D792 |
Continuous Use Temp | ℃ | -40~200 | -40~200 | -40~200 | – |
Volume Resistivity | Ω·cm | 8.5×1012 | 6.5×1012 | 4.0×1012 | ASTM D257 |
Breakdown Voltage | KV/mm | ≥5 | ≥5 | ≥7 | Content |
Flame Rating | – | V-0 | V-0 | V-0 | UL 94 |
Thermal Conductivity | W/M·K | 1.0 | 2.0 | 3.0 | ISO 22007-2 |
Basic specification: 25kg / large barrel, 1kg / small barrel.