Thermal solution for 3D printer

3D printer introduction:

3D printer is a technology that builds objects by layer-by-layer printing using adhesive materials such as powdered metal or plastic based on digital model files. With the rapid development of science and technology, 3D printing technology has entered our lives and has a profound impact in the fields of medical treatment, architectural design, scientific research, manufacturing, cultural relics protection, accessories, food and other fields.

The current 3D printer heats the material through the nozzle and then sprays the dissolved material onto the model. When the temperature of the nozzle reaches the temperature that can dissolve the material for normal printing, the temperature of the nozzle will continue to rise as the printing process progresses. When printing is complete, rapid cooling is required. To this end, it is necessary to control the temperature of the nozzle within a certain range to prevent the temperature of the nozzle from being too high and cause other components to dissolve and burn, and to be able to cool quickly. For this reason, 3D printers are usually equipped with heat dissipation devices to control the temperature range of the nozzles; however, the existing heat dissipation devices have slow heat dissipation and cooling rates, unreasonable structural settings, and difficult installation, which cannot meet the printing requirements of 3D printers.

In order to overcome the shortcomings of the existing technology, the 3D printer manufacturer provides a 3D printer cooling fan structure, which has a cooling device and a cooling device at the same time. High, compact structure, easy installation.

In order to achieve a gapless and flat appearance of 3D printers, adhesives are increasingly used to bond and fit components in the assembly process.

Glue requirements for 3D printers:

Temperature resistance -40~150℃;
High bonding strength to the chassis frame;
Strong adhesion to electronic components and thermal conductivity;
Environmental protection, non-toxic, with routine testing certification and qualifications;
Moisture-proof, anti-static, dust-proof, mildew-proof, salt spray resistance, etc. for circuit boards.

Glue scheme for 3D printer:

Glue dots for 3D printers	Glue function category	Adhesive Solution Features
Electronic Components	Thermal silica	Good thermal conductivity and heat dissipation, strong bonding ability, excellent electrical properties, anti-aging, waterproof, shockproof, safe and environmentally friendly
plastic case	adhesive sealant	Strong bonding ability, fast curing speed, resistance to alternating heat and cold, good electrical insulation, excellent acid and alkali resistance, aging resistance, UV resistance, no solvent, no pollution, no corrosion, easy to use
electronic circuit board	Three anti-paint	It has excellent insulation, moisture-proof, anti-leakage, shock-proof, dust-proof, anti-corrosion, anti-aging, corona resistance and other properties.

Due to the different structure, process and application environment of 3D printers, the glue application plan is different. For more details, please contact Cohetion

Thermal solution for 3D printer