Thermal Solutions for Network Switches

Thermal Solutions for Network Switches

With the rapid development of science and technology, our society has entered the information age. In this society, the network has become an indispensable part of people’s life. With the rapid development of the information age and the gradual popularization of cloud services, due to the popularity of cloud services, the amount of data storage in all walks of life has increased rapidly. The large-capacity expansion of servers also brings more demand for switches. I believe that everyone knows about routers, but most people generally don’t know what a network switch is. What can it do for our network?

Thermal Solutions for Network Switches

Network switches are important components that connect servers and network equipment to build a data center. However, due to the high density of network equipment caused by the popularization of cloud services, the surge in the number of connected devices makes the load on the switch even greater. New switches face the challenge of balancing increased performance with reduced power consumption.

The industrial switch integrates the MAC switching module, PHY interface chip, main control chip, memory and other devices. Since the impact of excessive temperature on industrial switches is fatal, when designing such products, in addition to selecting industrial components with a wide temperature range for the components of the equipment, more attention should be paid to the thermal design of the equipment.

Thermal Solutions

In order to meet the reliability application requirements of industrial-grade switches, most of the whole machines adopt a fanless cooling design. For chips with relatively large heat generation, thermally conductive silicone gaskets and thermally conductive phase change materials can be used to fill the gaps between the contact surfaces to form a thermal conduction channel from the chip surface to the shell, so as to ensure that the chips work in a safe temperature range and that the switches operate in a high temperature environment. to work reliably and safely.

thermal pad

The heat dissipation structure of the switch includes a switch shell and a circuit board: an upper heat-conducting gasket is arranged on the circuit board, a metal heat sink is arranged above the heat-conducting gasket, a heat-conducting gasket is arranged under the circuit board, and the heat-conducting gasket is connected to the shell of the switch. The inner surface is attached; the thermal pad is a certain elastic object, which can effectively ensure that the thermal pad is closely attached to the inner surface of the switch shell; part of the heat generated by the circuit board is transferred to the metal heat sink through the upper thermal pad and then diffused to the switch Internally, it diffuses into the air through the switch shell, and part of the heat is transferred to the switch shell through the lower thermal pad and then diffused into the air; this solution is especially suitable for small switches, which can effectively avoid the increase in volume caused by the installation of cooling fans. Increased cost, easy damage and other issues.

Thermal silicone gaskets are mainly used for heat conduction and heat dissipation between the motherboard and the shell. The main purpose of selecting the thermally conductive silicone gasket is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. The thermally conductive silicone gasket can fill the gap between the contact surfaces well; The contact surface between the heat source and the radiator is in better and full contact, so that face-to-face contact is truly achieved, and the temperature response can be as small as possible; the thermally conductive silicone sheet not only has insulating properties, but also has the effect of shock absorption and sound absorption .

Leave a Reply

Your email address will not be published.

Language »